Building on its accumulated experience in high-performance computing (HPC) data center design projects, PECL is striving to secure new projects in containerized modular data center design services. With a high level of professionalism, proactive attitude, and forward-looking vision, the PECL team delivers solutions through containerized modular design to meet customer needs for rapid deployment, flexible configuration, cost reduction, and standardization. This project marks PECL's first entry into the HPC containerized modular data center market. The design encompasses integrated MEP systems, as well as the arrangement (IML) of compute modules, power modules, cooling modules, and UPS modules. It also includes thermal management design, cabling, and optimized O&M pathways, aiming to further enhance PECL's capabilities and technology in containerized modular design and create new opportunities for business expansion in Taiwan and global data center markets.
Through cross-disciplinary collaboration (IT hardware, liquid cooling equipment, container manufacturing, power/HVAC suppliers), PECL applies emerging technology trends, supply chain resources, and standardized modular design methodologies to establish a replicable and scalable containerized modular design framework. This approach enables rapid replication across other AI/HPC MDC projects, delivering superior services to customers.